According to a new report from Digitimes, Apple will be looking to Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor. The remaining 20% will be taken over by Advanced Semiconductor Engineering (ASE), according to the report.
“Apple’s A8 chip will be a package-on-package (PoP) SoC solution comprising processors and mobile DRAM in a single package,” Mavis Hong and Jessie Shen report for Digitimes. “Taiwan Semiconductor Manufacturing Company (TSMC), which is believed to have landed foundry orders for Apple’s next-generation A8 chip, has also secured wafer bumping orders for the processor as part of its turnkey solution.”
TSMC is also expected to start increasing the production Apple’s A8 chip in the second quarter of 2014 using 20nm process technology, the report said.
Last year 9to5mac reported that TMSC was experiencing difficulties with its manufacture of 20nm chips. There is no indication that this has change.